IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision B provides new design guidance and requirements for laminate selection, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board edge spacing.